Samsung locks in roughly $200 billion Broadcom foundry and memory deal through 2030

Samsung Electronics and Broadcom said they will expand their collaboration across memory and foundry technologies to a value of roughly $200 billion through 2030. The agreement was unveiled around a San Francisco AI summit on July 24.

The deal hands Samsung a marquee AI-chip customer for its most advanced production lines, which have trailed market leader TSMC in landing high-volume orders at the leading edge.

Under the arrangement, Samsung will manufacture Broadcom-designed chips on its 2-nanometer-and-below process node, including parts for Broadcom’s Wireless Broadband Communications products. The two companies will also collaborate on high-bandwidth memory (HBM) supply for Broadcom’s AI accelerators, packaging Samsung’s foundry and memory businesses in a single deal.

For Samsung, the payoff is utilization. Advanced fabs carry enormous fixed costs and only earn out at high volume, so a long-running Broadcom order helps fill lines that have run below the capacity of TSMC’s leading nodes. The deal is expected to strengthen Samsung’s position as it competes with TSMC for AI-chip production.

The roughly $200 billion figure spans multiple years and product lines and reflects the companies’ own framing of the collaboration; neither Samsung nor Broadcom has broken out committed volumes or a firm schedule for when production ramps.