DRAM and HBM capacity for all of 2027 is reportedly sold out to AI buyers

Memory chipmakers have reportedly sold out their entire 2027 production capacity for DRAM and high-bandwidth memory (HBM), with AI hyperscalers and cloud providers booking the supply well before consumer buyers get a look.

Samsung, SK hynix and Micron have reportedly committed all of next year’s DRAM and HBM output. Roughly 70 percent of DRAM production is going to AI servers and HBM, the reports say, leaving about 30 percent for PCs, laptops and smartphones — a sharply smaller consumer slice than in 2026.

NAND flash memory is said to be in the same bind. Capacity for 2027 from Samsung, Micron and SanDisk is reportedly already booked, with Kioxia and SK hynix expected to lock in their own 2027 NAND contracts by the end of August.

None of the memory makers has publicly confirmed the sell-out, and the underlying figures come from trade reporting rather than company disclosures. New memory fabs take years to build, so any shortage that lands in 2027 would be hard to relieve quickly. The report frames next year as a potential record stretch for memory shortages.

If the allocations hold, consumers could face steeper prices for memory-heavy devices next year, with device makers including Apple expected to pass higher component costs along.